Chairman Liu interviewed by mainstream media

February, 16, standing committee member of the CPPCC, board chairman of Tongwei Group, Mr. Liu Hanyuan was interviewed by China Business News, and Southwest Urban Newspaper reporters.

On the price rise and future development trend of polysilicon market, Mr. Liu said, the industry downturn from H2 2009 to H1 2010 is mainly due to economic crisis influence. The sector is gradually getting back to normal in European markets with previous policies, rules and regulations. Yet, in 2010, the installed capacity of PV power generation doubled the amount of 2009. In the long run, the industry is up and rising, although there will be twists and turns.

In terms of Tongwei s investment and development in new energy cluster, Yongxiang exceeded the 2010 production capacity with its emission, control, raw material consumption, utilization ratio of production capacity, and quality product reaching top in the country. After June, 2011, the newly increased 3,000 tons polysilicon project will be completed and commissioned. By the end of June, 2012, Leshan Qianwei 6,000 tons polysilicon project will be put into operation. By then Yongxiang will have an annual production capacity of 10,000 15,000 tons.

Mr. Liu also made a summary of Tongwei s development in the past 10 years into 3 stages. Tongwei s share listing in 2004 was the watershed. Before that, the company had been preparing to turn into a company with modern corporate mechanism. The second stage was the expansion period from 2004 to 2007 with several new sub-companies established each year. The third stage started from the entering of new energy sector and Yongxiang projects all-round outset.

On the secret of gaining personal and business success, as for the latter, Mr. Liu said the key is to find the balance point of corporate long-term development. As for personal success, Mr. Liu regards himself as a perfectionist with idealism. We have to pursue excellence of each key point which add together will form the success of the whole process.