Neusoft and Intel to Establish Technology Centers

Shenyang, China- April 8, 2004 - Today Neusoft Group and Intel Corporation announced a memorandum of understanding (MOU) that outlines the companies' plans to establish a Beijing Solution Innovation Center and a Shenyang Product Research Laboratory. The companies' collaboration will focus on building a trustworthy computing environment, developing key technologies for the next-generation Internet, and supporting the modernization of the region's manufacturing industry.

As one of China's leading solution providers, Neusoft is committed to developing embedded software products and solutions for customers that feature higher performance, more security, and easier management, said Dr. Liu Jiren, chairman and president of Neusoft. Through this strategic cooperation Neusoft will be able to extend its research and development capabilities to create and deploy optimized hardware and software solutions for industries of digital medical care, digital household appliances, mobile communication devices and electronic equipment for automobiles based on Intel Architecture.

Intel's R&D collaboration with Neusoft will create innovative new hardware and software solutions, bringing our common vision of a digital world built upon converged computing and communications technology closer to reality, said Craig Barrett, Intel CEO.

The Beijing Solution Innovation Center plans to develop next generation, flexible, reliable, high-performance industry solutions based on the Intel ? Itanium^TM processor platform. The Shenyang Product Research Laboratory will focus on developing embedded software for digital products based on Intel Architecture.

Both sides agree that to accelerate the deployment of a robust technology infrastructure and realize price-to-performance benefits, open architecture, international standards, and cross platform software are key to new IT solutions.